Two Component, Room Temperature Curing, Thermally Conductive, Electrically Isolating Epoxy for Bonding and Sealing Featuring High Temperature Resistance along with High Shear and Peel Strength.
Two Component, Room Temperature Curing High Temperature Resistant Epoxy Adhesive/Sealant For Service from -112°F to +400°F Featuring High Peel and High Shear Strength
Two Component, Room Temperature Curing, High Temperature Resistant Epoxy Adhesive/Sealant for Service from -112°F to +400°F Featuring High Peel and High Shear Strength. Meets NASA Low Outgassing Specifications.
One Component, Fast Curing, Toughened Epoxy for Bonding, Sealing and Coating Featuring Excellent Thermal Conductivity and Very Good Electrical Insulation Properties. Can Withstand Rigorous Thermal Cycling.
Two Component, Toughened, Quartz Filled, Heat Resistant Epoxy Compound for High Performance Bonding, Sealing and Casting Widely Used in Downhole, Oil Processing and Other Petrochemical Applications.
Two Component Toughened Heat Resistant Epoxy Adhesive for High Performance Structural Bonding, Sealing and Coating. Featuring Serviceability up to 500°F. Superior Thermal Cycling Capabilities.
One Component, Low Viscosity UV Curable System for High Performance Bonding, Sealing & Coating, Featuring Excellent Physical Properties and Dimensional Stability.
One Component, UV Curable System for High Performance Coating, Bonding and Sealing, Featuring Excellent Physical Properties and Dimensional Stability; Exceptionally Low Viscosity; Ideal for Applications Involving Spin Coating.
One Component, Low Viscosity UV Curable System for High Performance Bonding, Sealing & Coating, Featuring Excellent Physical Properties and Dimensional Stability. Meets USP Class VI Specifications.
