Two Component, Thermally Conductive, Electrically Insulating Epoxy for High Performance Bonding, Sealing and Encapsulation. Features a Glass Transition Temperature in Excess of 200°C; Requires Elevated Temperature Curing at 250°F or Above. Meets NASA Low Outgassing.
Two Component Heat Resistant Epoxy System for High Performance Structural Bonding and Casting Featuring a Glass Transition Temperature in Excess of 220°C Suitable for Repeated Autoclaving, Radiation and Chemical Sterilants Meets USP Class VI Requirements
Two Component, Room Temperature Curing, Thermally Conductive, Electrically Insulating Epoxy Adhesive, Sealant and Coating Featuring a Convenient 1:1 Mix Ratio and Fast Cure
Two Component High Performance Epoxy System for Bonding and Sealing, Ultra Fast Setting, 3 Minute Type Curing System Featuring Cryogenic Serviceability.
