Master Bond EP29LPSPND-3 is a two component, non-drip epoxy compound with a paste consistency that can be used for bonding and sealing applications. The system is electrically non-conductive and thermally insulative, with a thermal conductivity of approximately 0.2 W/(m•K) at room temperature. It withstands cryogenic temperatures and is serviceable in the range from 4K to 250°F.
Master Bond LED415DC90Med is a one component, dual cure adhesive system designed for high-speed manufacturing of medical electronic devices. It cures rapidly without oxygen inhibition upon exposure to 405 nm LED light, followed by a short 30-45 minute heat cure at 90-95°C, making it well-suited for bonding heat sensitive components.
Master Bond has launched EP53TC, a two-component epoxy designed for bonding, sealing, coating, and small potting applications where efficient heat dissipation is crucial. The epoxy is formulated with a specialty filler with a particle size ranging from 5 to 30 microns. It is a flowable system with a mixed viscosity of 45,000-65,000 cps at room temperature.
Master Bond Supreme 121AOND is a toughened epoxy system for bonding and sealing applications. It is a two component, heat curing system with a thixotropic paste consistency.
Supreme 121AOND not only provides excellent chemical resistance, but also offers a high glass transition temperature (Tg) of 200-210°C.
Developed for medical device applications, Master Bond EP21LSCL-2Med is a two component non-cytotoxic epoxy for bonding, sealing, coating and potting.
While most if not all epoxies will yellow over time, especially upon exposure to heat and intense UV light, EP21LSCL-2Med has been designed
Master Bond EP3HT-LO is a single component, non-premixed & frozen, heat cured epoxy, with an unlimited working life at room temperature.
This system passes ASTM E595 tests for NASA low outgassing, making it well suited for use in the aerospace, electronic, microelectronic and optical industries.