One Component Thermal Shock and Heat Resistant Flexibilized Epoxy System For High Performance Electrical Potting, Encapsulation and Bonding Superior for underfill applications
One Component, Epoxy System for Bonding, Sealing and Coating Featuring Very Fast Cure along with High Shear Strength Properties. Meets USP Class VI Specifications.
One Part, Lower Viscosity, Thermally Conductive Epoxy System for High Performance Potting, Encapsulation and Underfill Applications Featuring Exceptional Dimensional Stability and Rapid Curing at 230-250°F.
Two Component, Flexible, Low Viscosity Epoxy Compound With Outstanding Shear and Peel Strength For Bonding, Potting, And Sealing. Featuring Excellent Adhesion To Engineering Plastics And Metals, Especially Polycarbonates And Acrylics
Two Component, Room Temperature Curable Epoxy Adhesive, Sealant, Coating and Encapsulating System, Featuring Outstanding Chemical Resistance to Solvents, Alcohols and Fuels.
Two Component, Room Temperature Curable Epoxy Adhesive, Sealant, Coating and Encapsulating System, Featuring Outstanding Chemical Resistance to Solvents, Alcohols and Fuels, Along with High Temperature Resistance.
Two Component Low Viscosity Epoxy System For High Performance Bonding, Sealing, Coating. Including Small Encapsulations, Pottings & Castings Featuring Fast Set-Up and Handling Time Meets USP Class VI and ISO 10993-5 Specifications for Medical Applications.
Two Component, Low Viscosity Room Temperature Curable, Epoxy Adhesive, Sealant, Coating & Casting System Featuring Both Outstanding Chemical and Heat Resistance.
Two Component, Room Temperature Curable Epoxy Adhesive, Sealant, Coating and Encapsulating System Featuring Outstanding Heat, Chemical and Steam Resistance.
