Master Bond EP30F is a low viscosity, two component epoxy system for high performance bonding, coating, sealing, potting and encapsulation. It readily cures at room temperature or more rapidly at elevated temperatures, and has a four to one mix ratio by weight. EP30F is a fast setting system that typically has a handling time of 25-30 minutes. This adhesive is 100% reactive and does not contain any solvents or diluents. EP30F has outstanding physical strength properties along with highly reliable electrical insulation characteristics. This dimensionally stable system has very low linear shrinkage after cure, less than 0.003 in./in. EP30F possesses very good optical clarity along with superior light transmission when compared to many other epoxies. EP30F bonds well to a variety of substrates including metals, glass, and ceramics, as well as many plastics and rubber materials. EP30F forms high strength, rigid bonds that resist chemicals including water, oils and fuels. Its low viscosity enables this system to be used for special gap filling applications where space is limited. Master Bond EP30F is widely used in electronic, electrical, optical, fiber-optic, aerospace and related industries, particularly where low viscosity and faster curing
are desirable.
Product Advantages
- Easy to use mix ratio—four to one by weight
- Easy application: only contact pressure required while curing; adhesive spreads readily
- Versatile cure schedules: ambient temperature cures or faster at higher temperatures
- Low viscosity; ideal for gap filling applications and smaller encapsulations
- Exceptional physical strength and electrical insulation properties
- Relatively short fixture time
