Toughened, two component epoxy for bonding, sealing, coating and encapsulation
Key Features
- Lower viscosity
- Toughened system
- Cryogenically serviceable
- Good abrasion resistance
Product Description
Master Bond EP30DPSP is a versatile, two component, urethane-modified epoxy system featuring superior toughness, strength and abrasion resistance for high performance bonding, sealing, coating and encapsulation. It blends performance the characteristics of epoxies, such as strength and chemical resistance with urethane-style toughness and abrasion resistance. It is a lower viscosity epoxy with a ten to one mix ratio by weight. EP30DPSP cures readily at room temperature or more rapidly at elevated temperatures. The optimum cure is overnight at room temperature followed by 3-4 hours at 140-180°F. It is 100% reactive and does not contain any solvents or diluents and has low linear shrinkage upon curing.
It bonds well to a wide variety of substrates including metals, glass, ceramics and many types of rubbers and plastics. Its toughness allows it to withstand thermal cycling as well as mechanical and thermal shock. Upon curing, EP30DPSP has very good electrical insulation properties. These characteristics along with its low viscosity and relatively long open time enables it to be very useful for potting and encapsulation applications. It has good chemical resistance to water, fuels and oils, among others. And of special note, EP30DPSP is cryogenically serviceable. Its service temperature range is 4K to +250°F. The color of Part A is black, Part B light clear yellow. Also, this urethane epoxy blend resists abrasion quite well. EP30DPSP can be considered for applications in aerospace, electronic, electrical, specialty OEM and related industries where the properties mentioned above are desirable.
Product Advantages
- Low viscosity, low exotherm and long working life
- Superior toughness and resistance to thermal cycling
- Excellent electrical insulation properties
- Cryogenically serviceable
- Superb abrasion resistance
- Useful for both electronic and structural applications
Packaging
EP30DPSP is available is various sizes and units to accommodate customer's needs.
