Expanded Product List
Master Bond Product Search
619 products match
 |
EP17HTDA-1 Single component heat curable epoxy adhesive/sealant. Non-drip system. Resists up to 525°F. Meets NASA low outgassing specifications. Meets MIL-STD-883J Section 3.5.2 for thermal stability. High lap shear, tensile and compressive strength. Tg of 230-240°C after post cure. |
 |
EP17HTDA-2 One component, heat cured epoxy for bonding and sealing, as well as die attach applications. Flowable, high viscosity system, cures in 4-5 hours at 300°F or 3-4 hours at 350°F. Post cure to optimize properties. High glass transition temperature. NASA low outgassing approved. |
 |
EP17HTDM-2 Black One component, heat cured epoxy for bonding and sealing, as well as die attach applications. Flowable, high viscosity system, cures in 4-6 hours at 300°F or 2-3 hours at 350°F. Post curing at 400°F for 1-2 hours to optimize properties. Limited flow and low exotherm when curing. |
 |
EP17HTND-2 Single component heat curable epoxy epoxy adhesive/sealant. Non-drip system. Resists up to 600°F. Meets NASA low outgassing specifications. High lap shear, tensile and compressive strength. Tg of 230-240°C after post cure. |
 |
EP17HTND-CCM Single component heat curable epoxy epoxy adhesive/sealant. Non-drip system. Resists up to 550°F. Meets NASA low outgassing specifications. High lap shear, tensile and compressive strength. Tg of 160-165°C after post cure. |
 |
EP17HTS-DA Silver filled, one part, no mix, die attach epoxy with electrical conductivity and high temperature resistance. It is a silver filled system. This specialty formulation maintains a high Tg of 140-150°C and passes MIL-STD-883J thermal stability requirements at 200°C. |
 |
EP17TF One part, heat cured epoxy system. Heat resistant to +550°F. High compressive and tensile shear strength. Excellent toughness and resistance to thermal cycling, shock and vibration. Paste consistency. |
 |
EP19HT One component, storage stable epoxy resin system. Viscosity 500-600 cps. Tensile strength over 10,000 psi. Excellent chemical resistance. Thermal stability up to +400°F. Superb electrical insulation properties. Withstands 1,000 hours 85°C/85% RH. Serviceable from -60°F to +400°F. |
 |
EP19HTFL Toughened, ultra low viscosity no mix formulation. Shore D hardnes >65. Resists impact and thermal cycling. Light amber clear color. Outstanding physical strength properties. Used for sealing/impregnation of porous surfaces. Serviceable from -60°F to +350°F. |
 |
EP19HTLV Ultra low viscosity, thermally stable high performance system. Tg 125-130°C. Resists water, oils, fuels and most solvents. Superior adhesion to metal and ceramics. "Unlimited" working life at room temperature. Serviceable up to 400°F. Ideal for impregnation of porous surfaces. |