Expanded Product List
Master Bond Product Search
619 products match
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EP3SP5FL-ND2 Snap cure epoxy adhesive. Paste viscosity. Cures in 1-2 minutes at 300°F. Readily reworkable. Good bond strength and electrical insulation properties. Serviceable from -60°F to +200°F. |
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EP3UF One component epoxy for bonding and underfill applications. Thermally conductive/electrically insulative. Meets NASA low outgassing specifications. High mechanical strength properties. Ultra fine particle sizes lowers thermal resistance. Convenient processing at moderate temperatures. Serviceable from -60°F to +250°F. |
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EP3UF-1 One component epoxy for bonding and underfill applications. Thermally conductive/electrically insulative. Meets NASA low outgassing specifications. High mechanical strength properties. Ultra fine particle sizes lowers thermal resistance. Convenient processing at moderate temperatures. Serviceable from -60°F to +250°F. |
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EP40 Excellent adhesion to metals and engineering plastics such as polycarbonates, acrylics. Flexible. Low to moderate viscosity bonding, potting, sealing, encapsulation compound. High shear/peel strength. Resists mechanical shocks and vibration. Moderately low exotherm during cure. Serviceable from -80°F to +250°F. |
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EP40Med Excellent adhesion to metals and engineering plastics such as polycarbonates, acrylics. Flexible. Low to moderate viscosity bonding, potting, sealing, encapsulation compound. High shear/peel strength. Resists mechanical shocks and vibration. Moderately low exotherm during cure. Serviceable from -80°F to +250°F. |
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EP40ND Excellent adhesion to metals and engineering plastics such as polycarbonates, acrylics. Flexible. For bonding, potting, sealing compound. High shear/peel strength. Resists mechanical shocks and vibration. Moderately low exotherm during cure. Serviceable from -100°F to +250°F. Paste consistency. |
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EP40NDMed Excellent adhesion to metals and engineering plastics such as polycarbonates, acrylics. Flexible. For bonding, potting, sealing compound. High shear/peel strength. Resists mechanical shocks and vibration. Moderately low exotherm during cure. Serviceable from -100°F to +250°F. Paste consistency. Meets ISO 10993-5 for cytotoxicity. |
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EP40TC Flexible, moderate viscosity bonding, potting, sealing, encapsulation compound. High shear/peel strength. Easy processing, high elongation, vacuum compatible. Serviceable from -100°F to +300°F. |
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EP40TCMed Flexible, moderate viscosity bonding, potting, sealing, encapsulation compound. High shear/peel strength. Easy processing, high elongation, biocompatible. Serviceable from -100°F to +300°F. |
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EP41S Room temperature curing epoxy featuring excellent chemical resistance. 100% reactive. High bond strength. Fast cure speed. Withstands exposure to organic solvents. Convenient processing. Service temperature range -60°F to +250°F. Excellent electrical insulation properties. |