Expanded Product List
Master Bond Product Search
184 products match
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EP21AN Thermally conductive/electrically insulative epoxy. Two part system cures at ambient temperatures. Has convenient one to one mix ratio by weight or volume. Excellent heat transfer characteristics. High bond strength. Shore D hardness 85-90. Low coefficient of expansion. Serviceable from -60°F to +250°F. |
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EP21ANHT Thermally conductive, electrically insulative epoxy has a 1 to 1 mix ratio by weight or volume. High bond strength. Resists -60°F to 400°F. Low shrinkage. Outstanding dimensional stability. Superior heat dissipation properties. Thermal conductivity 22-24 BTU · in/ft2· hr /°F [3.173 - 3.4615 W/m · K]. Low coefficient of expansion. Gray color. |
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EP21AO Room temperature curing thermally conductive/electrically insulative epoxy adhesive. Convenient one to one mix ratio, weight or volume. High bond strength. Adheres well to metals, composite, ceramics, glass, rubbers and most plastics. Superb dimensional stability. Serviceable from -60°F to +250°F. |
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EP21AOHT Two component epoxy adhesive features thermal stability and heat dissipation properties. Superb electrical insulator. High compressive strength. Excellent dimensional stability. Resists -60°F to +400°F. Non-critical one to one mix ratio by weight or volume. Gap filling system. |
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EP21AOHTLV Low viscosity two component thermally conductive/electrically insulative epoxy. Resists -60°F to +400°F. Bonds withstand exposure to thermal cycling and chemicals. Can be used as potting compound. Cures at room temperature or more rapidly at elevated temperatures. |
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EP21AOLV Excellent thermal conductivity/electrical insulation properties. Flows nicely. Easy application for bonding and potting. Serviceable from -60°F to +400°F. Cures at room temperatures. High compressive strength. Convenient one to one mix ratio by weight or volume. |
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EP21AOLV-1 Excellent thermal conductivity/electrical insulation properties. Flows nicely. Easy application for bonding and potting. Serviceable from -60°F to +400°F. Cures at room temperatures. High compressive strength. Convenient one to one mix ratio by weight or volume. |
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EP21AOLV-2LO Two part, ambient temperature curing epoxy potting/encapsulation compound. Thermally conductive/electrically isolating. Very low exotherm. Suitable for large castings. Meets NASA low outgassing specifications. Service operating temperature range from -60°F to +250°F. Withstands 1,000 hours 85°C/85% RH. |
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EP21AOLV-2Med Meets USP Class VI requirements and passes ISO 10993-5 tests for cytotoxicity. Smooth flowable consistency. Thermally conductive//electrically insulative. Can be used for bonding, sealing, coating, encapsulation. One to one mix ratio. Cures at room temperature. Resists EtO, radiation, and chemical sterilants. Serviceable from -60°F to +250°F. |
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EP21AOND Two component non-drip epoxy adhesive. Thermal conductive/electrically insulative. Versatile cure schedules. High bond strength to similar and dissimilar substrates. Serviceable from -60°F to +250°F. |