Expanded Product List
Master Bond Product Search
356 products match
 |
EP21TDC-2AOLV Flexible high performance adhesive, sealant, encapsulant. Excellent heat dissipative properties. High dielectric strength. Long working life. Low exotherm. Elongatio >25%. Low viscosity formulation bonds well to similar and dissimilar substrates. Serviceable from 4K to +250°F. |
 |
EP21TDC-2LO Highly flexibilized, thermally conductive/electrically insulative epoxy adhesive. High elongation. Exhibits superior shear and peel strength properties. Serviceable from 4K to 250°F. Withstands thermal cycling, thermal shock and mechanical shock. Passes NASA low outgassing test. Cures at room temperature or more quickly at elevated temperatures. |
 |
EP21TDC-2LOND Highly flexible epoxy paste adhesive. Outstanding peel strength. Elongatio >25%. Thermally conductive/electrically insulative. Low outgassing. |
 |
EP21TDC-2ND Two part highly flexible epoxy resin system. Smooth paste viscosity. Fills gaps. Excellent peel strength. Dependable resistance to thermal cycling. |
 |
EP21TDC-4 Two part, room temperature curing epoxy with outstanding flexibility and superb adhesion to many rubbers and metals. Excellent thermal cycling properties. Ability to withstand mechanical shock and vibration. T-peel strength 25-35 pli. Elongatio >200%. Water and chemical resistant. Operating temperature range -100°F to +250°F. |
 |
EP21TDC-4HT Toughened epoxy compound for high performance bonding, sealing, casting. Serviceable from -65°F to +400°F. Cures at ambient temperatures. Excellent electrical insulative characteristics. Compound flows readily. Bonds well to untreated rubbers such as neoprene, nitrile SBR and EPDM. Superior shear and peel strength properties. |
 |
EP21TDC-4ND Smooth paste epoxy adhesive. High flexibility. Elongatio >200%. Impressive resistance to mechanical vibration and shock. Outstanding adhesion to rubbers such as SBR, nitrile, neoprene. T-peel strength >30 pli. Serviceable from -100°F to +250°F. |
 |
EP21TDC-7 High peel strength, room temperature curing epoxy. Has an elongation over 300%. Low temperature serviceability. Adheres well t natural rubber, neoprene, nitrile, SBR without surface preparation. Serviceable from -100°F to +250°F. Excellent resistance to thermal shock. T-peel strength > 40 pli. Can cure underwater. |
 |
EP21TDCANHT Features exceptional thermal conductivity. High dielectric strength. Idea for joining dissimilar substrates. Serviceable from -100°F to +400°F. Superior durability. Will cure at room temperature. |
 |
EP21TDCAOHT Flexibilized two component epoxy offers thermal conductivity/electrical insulative properties. High peel/shear strength formulation. Paste viscosity. Will not drip on vertical surfaces. Bonds well to dissimilar substrates. Serviceable from -100°F to +350°F. |