Expanded Product List
Master Bond Product Search
356 products match
 |
EP21NS Moderate viscosity Nanosilica epoxy resin system. High strength rigid bonds. Lower linear shrinkage after cure. Serviceable from -80°F to +250°F. Cures readily at room temperature. |
 |
EP21Q Two component quartz filled epoxy compound. Protects against corrosion. Paste viscosity. Paste viscosity. Can be applied on vertical surfaces without dripping. High strength system. Excellent dimensional stability. Service temperature range from -60°F to 250°F. |
 |
EP21QF Two component, moderate viscosity epoxy. The service temperature range is -80°F to +300°F. Color coded for easy mixing. Good physical strength profile. |
 |
EP21SC-1 High performance, abrasion resistant epoxy system. Silicon carbide filled compound. Convenient one to one mix ratio. Resists thermal cycling and many chemicals. Exceptional bond strength. Low coefficient of thermal expansion. Excellent electrical insulation properties. Paste consistency. Serviceable from -60°F to 250°F. |
 |
EP21SL5 Epoxy adhesive for bonding teak wood and other types of wood. Inique capability of adhering well to oily surfaces. Inert to water and many chemicals. Service temperature range -60°F to 275°F. 100% reactive. High strength. Long term durability. |
 |
EP21TCHT-1 Two part, room temperature curable epoxy system with high thermal conductivity. Serviceable from cryogenic temperatures up to +400°F. Electrically isolating. Meets NASA low outgassing specifications. Halogen free. Paste consistency. Formulated to cure at ambient temperatures. Withstands 1,000 hours 85°C/85% RH. |
 |
EP21TDC Superior toughness. Ideal for bonding similar and dissimilar substrates. Withstands aggressive thermal cycling. Convenient one to one mix ratio. Good flow properties. User friendly. Versatile cure schedule. Serviceable from -60°F to +250°F. |
 |
EP21TDC-2 Highly flexibilized. Serviceable from 4K to +250°F. Excellent peel strength. Superb thermal and electrical insulator. Good flow. Easy to apply. Low exotherm. Cures at ambient temperature. Variable hardness depending on cure schedule. |
 |
EP21TDC-2AN Flexibilized. Thermally conductive/electrically insulative. Thermal conductivity 22-24 BTU· in/ft2 hr· ° F. Serviceable from 4K to +250°F. Superb impact resistance. Long working life. High peel strength. Elongatio >25%. |
 |
EP21TDC-2AO Flexible high performance adhesive, sealant, encapsulant. Excellent heat dissipative properties. High dielectric strength. Long working life. Low exotherm. Elongatio >25%. Bonds well to similar and dissimilar substrates. Serviceable from 4k to +250°F. |