Expanded Product List
Master Bond Product Search
356 products match
 |
EP21LVFL Epoxy adhesive, sealant, coating with excellent flexibility, low modulus, flows easily and readily. Resists thermal cycling, shock, vibration and other types of stresses. Bonds well to a wide range of substrates including metals, glass, ceramics, composites, as well as many types of rubbers and plastics |
 |
EP21LVMed Biocompatible two component epoxy adhesive, sealant, coating, encapsulant. Passes USP Class VI testing. Thermal cycling resistant. Can withstand exposure to EtO, radiation, chemical sterilants. Low viscosity. Easy to apply. Serviceable from -65°F to +250°F. |
 |
EP21LVSP6 Two component epoxy has very low exotherm, Suitable for large casting applications. Low viscosity formulation cures at room temperature. Extended working life. Serviceable from -60°F to +250°F. Magnificent electrical insulation properties. Excellent physical strength. |
|
EP21LVTK-2 Moderate viscosity with good flow. Room temperature curing epoxy adhesive, sealant, casting. Convenient one to one mix ratio, weight or volume. High strength system. Withstands exposure to many chemicals. Reliable electrical insulator. Serviceable from -60°F to +250°F. |
|
 |
EP21ND Two part, room temperature curing epoxy with easy handling and very good physical strength properties. Non-drip paste. For bonding, sealing, coating. One to one mix ratio. Chemically resistant. Gap filling. Variable mix ratio allows adjusting hardness of cure. Low shrinkage. Service temperature range from -60°F to 250°F. |
 |
EP21ND-2 Two component non-drip epoxy paste. Outstanding physical strength properties. Non-critical one to one mix ratio. Easy to apply. Variable mix ratio to adjust fardness of cure. Excellent dimensional stability. Serviceable from -60°F to 250°F. |
 |
EP21ND-LO Non-drip epoxy paste passes NASA low outgassing requirements. Can be applied without sagginf on vertical surfaces. Gap filling. Dimensionally stable. Cures at ambient temperatures. Long term durability. Serviceable from -60°F to 250°F. |
 |
EP21ND-LP Two part, room temperature curing epoxy with easy handling and very good physical strength properties. Smooth paste. For bonding, sealing, coating. One to one mix ratio. Chemically resistant. Gap filling. Variable mix ratio allows adjusting hardness of cure. Low shrinkage. Service temperature range from -60°F to 250°F. |
 |
EP21NDCL Two component, room temperature curing non-flowing epoxy paste. Cures optically clear in thin sections. Superior physical strength profile. Non-critical one to one mix ratio by weight or volume. Service temperature range from -60°F to 250°F. Withstands 1,000 hours 85°C/85% RH. |
 |
EP21NDFG Non-drip epoxy paste. Meets FDA Section 107.105 for indirect food applications. Can be used for bonding, sealing, coating. Able to adjust hardness of the cured system by altering the mix ratio. Excellent electrical insulation properties. Serviceable from -60°F to 250°F. |