Master Bond Product Search

109 products match

EP4TC-80 One Part Epoxy EP4TC-80

One component epoxy for bonding, sealing and small encapsulation applications. High thermal conductivity and electrical insulation properties. Paste consistency epoxy featuring ultra fine particles filler material that allows application in very thin sections. High compressive strength, tensile modulus and dimensional stability. Serviceable from -50°C to +175°C.

EP4UF-80 One Component Epoxy EP4UF-80

One component, low viscosity epoxy primarily for underfill applications. Not premixed and frozen, with unlimited working life at room temperature. Cures at elevated temperatures with a minimum of 80°C. The service temperature range is -50°C to +150°C.

EP50-1.5 Two Component Epoxy EP50-1.5

Rapid room temperature curing two component epoxy adhesive. Fixturing time of 5-8 minutes. Working life after mixing a 40 gram batch 2-3 minutes. One to one mix ratio by weight or volume. Solid tensile shear strength. Serviceable from 4K to +250°F. Available in different colors and viscosities.

EP51M Two Part Epoxy EP51M

Rapid curing at room temperature. Fixturing period 7-12 minutes. Convenient one to one mix ratio by weight or volume. High bond strength and long term durability. Withstands 1,000 hours 85°C/85% RH. Serviceable from 4k to +250°F. Available in various viscosities and colors.

EP5G-80 One Component Epoxy EP5G-80

Graphite filled epoxy that cures at 80°C. Good electrical and thermal conductivity. Passes NASA low outgassing certification. Can be used for bonding, sealing, coating. Service temperature range is -50°C to +175°C

EP5LTE-100 is a flowable, one part epoxy with a low coefficient of thermal expansion EP5LTE-100

One component flowable epoxy for bonding and sealing applications. Unlimited working life. Low coefficient of thermal expansion. Non conductive.

EP5TC-80 One Component Paste Epoxy EP5TC-80

One component flowable paste epoxy for bonding, sealing and small encapsulation applications. High thermal conductivity and electrical insulation properties. Ultra fine particles filler material that allows application in very thin sections. Low exotherm and great dimensional stability. Serviceable from -50°C to +150°C.

LED405FL One Part LED Curable Adhesive LED405FL3

Fast cures under LED light. Outstanding optical clarity, with fluorescent dye. Can be used for small potting and encapsulation, as it can cure up to 1/8 inch thick. Withstands rigorous thermal cycling, mechanical shock and vibration. Serviceable from -100°F to +250°F.

One Part Adhesive LED415DC90 LED415DC90
LED415DC90Med One Part LED and Heat Curing Adhesive LED415DC90Med

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