Through heat dissipation, thermally conductive adhesives and potting compounds play a pivotal role in the protection of today’s electronic circuitry. In tandem with the great growth of the technological sector comes the need for a new generation of innovative, highly advanced solutions capable of reliable performance in the ever increasing temperatures of electronic devices. Master Bond’s white paper examines the challenges design engineers face as chip makers up the ante on microprocessor power and density, and how thermally conductive adhesives and potting compounds can manage heat while solving other application issues.
