New Low Viscosity Adhesive/Sealant Cures at Room Temperature

Master Bond Inc., Hackensack, NJ has developed a new, easy to use, two component epoxy adhesive for high performance bonding applications called EP30. It develops outstanding physical strength properties even when cured at ambient temperatures. Cure can be accelerated by use of moderate heat. EP30 features very low viscosity along with outstanding chemical resistance, dimensional stability, hardness and superb optical clarity. Electrical insulation properties are superior even upon prolonged exposure to moisture. EP30 is widely used in potting and encapsulating electronic components as well as in bonding optical elements. For medical applications, a USP Class VI approved version called EP30MED is also available.

Master Bond EP30 has excellent adhesion to a wide variety of substrates including metals, ceramics, glass and many plastics. Typically, the lap shear strength exceeds 3,000 psi for aluminum to aluminum bonds. EP30 also has exceptionally low shrinkage upon cure. It is especially suited for assemblies where only very thin bond lines are dictated by design considerations.

Master Bond EP30 is available in 1/2 pint, pint, quart, gallon and 5 gallon kits. It is also available in gun applicators and double pouch divider packs for ease of application.

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