Two Component, Room Temperature Curing Epoxy for High Performance Bonding, Sealing, Coating and Potting Featuring Optical Clarity and High Temperature Resistance. Meets NASA Low Outgassing Specification ASTM E595.
Two Component, Room Temperature Curing Epoxy Compound for High Performance Bonding, Sealing, Casting and Potting Offers Outstanding Chemical Resistance along with Superior Physical Strength Properties.
One Component, Moderate Viscosity UV Curable System for High Performance Bonding, Sealing & Coating, Featuring Superb Physical Properties and Enhanced Dimensional Stability, Temperature and Chemical Resistance.
One Component, Room Temperature Curing, Silicone Elastomer System for High Performance Bonding and Sealing; Featuring Paste Consistency, Non-Corrosive Cure and Serviceability Up to 300°C; Unsurpassed Stability at Elevated Temperatures
One Component, Room Temperature Curing Silicone Elastomer Adhesive for High Performance Bonding and Sealing. Fast Curing and Non-Corrosive.Meets MIL-A-46146 Type 2.
Two Component, Addition Cured Silicone for High Performance Bonding and Sealing, Featuring High Temperature Resistance, Excellent Flexibility and Paste Consistency; Self Priming System.
Two Component, Room Temperature Curable, High Temperature Resistant Epoxy System, Sealant, Coating and Casting System Resists Multiple Cycles of Medical Sterilization Including Radiation, Chemicals and Steam.
Two Component, Low Viscosity Heat Curing Epoxy Resin System High PerformanceThermal Conductive & Electrical Insulation For Potting & Encapsulation Applications
