One component epoxy for bonding, sealing and small encapsulation applications, curing temperature 80°C. Thermally and electrically conductive, high compressive strength. Meets NASA low outgassing specifications. Non-metallic, graphite filler.
Two Component, Room Temperature Curing High Temperature Resistant Epoxy Adhesive/Sealant For Service from -100°F to +350°F Featuring High Peel and High Shear Strength
Two Component, Room Temperature Curing High Temperature Resistant Epoxy Adhesive/Sealant For Service from -100°F to +250°F Featuring High Peel and High Shear Strength
One component epoxy for bonding, sealing and small encapsulation applications, curing temperature 80°C. Thermally conductive, electrically insulating, high compressive strength.
Two Component, Room Temperature Curable Epoxy Adhesive, Sealant, Coating and Encapsulating System, Featuring Outstanding Chemical Resistance to Acids and low viscosity.
Highly Versatile, Low Viscosity, Two Component Epoxy System for High Performance Bonding, Coating, Sealing and Casting; Featuring Superb Optical Clarity.
