Two Component, Room Temperature Curing Epoxy Adhesive for Bonding, Sealing and Coating Featuring High Temperature Resistance, Outstanding Dimensional Stability and Machinability along with Superior Chemical Resistance.
Two Component, Lower Viscosity Room Temperature Curing Epoxy Adhesive for Bonding, Sealing and Coating Featuring High Temperature Resistance, Outstanding Dimensional Stability and Machinability along with Superior Chemical Resistance.
Two Component, Paste Consistency Room Temperature Curing Epoxy Adhesive for Bonding, Sealing and Coating Featuring High Temperature Resistance, Outstanding Dimensional Stability and Machinability along with Superior Chemical Resistance.
One Component, B-Stage, High Temperature Resistant, Toughened Epoxy System for Potting, Encapsulation, Coating and Bonding Applications; Featuring Very High Thermal Conductivity and Electrical Isolation. Available in 30 Gram Cookies.
One Component, B-Stage, High Temperature Resistant, Toughened Epoxy System for Potting, Sealing, Coating and Bonding Applications; Featuring Low Viscosity and Excellent Electrical Insulation Properties. Available in 30 Gram Cookies.
