Dimensionally Stable

EP21AOHT Product Information

EP21AOHT Two Part Epoxy Adhesive

Two Component, Room Temperature Curing, Thermally Conductive, Electrically Insulating Epoxy Adhesive, Sealant and Coating Featuring a 1:1 Mix Ratio and High Temperature Resistance Up To 400°F

EP21AOHTLV Product Description

EP21AOHTLV Two Part Epoxy

Two Component Heat Resistant Epoxy Adhesive, Sealant, Encapsulant With High Thermal Conductivity, and Excellent Dimensional Stability Up to 400°F Service

EP21AOLV-1 Product Information

EP21AOLV-1 Two Part Epoxy

Two Part, Room Temperature Curing Epoxy System Offers Thermal Conductivity and Electrical Insulation for Potting & Encapsulation as well as Bonding, Sealing and Coating; Has a Forgiving One to One Mix Ratio.

EP21AR Product Information

EP21AR Two Component Epoxy System

Two Component, Room Temperature Curable Epoxy Adhesive, Sealant, Coating and Encapsulating System, Featuring Outstanding Chemical Resistance to Acids.

EP21BAS Product Information

EP21BAS Two Part Radiopaque Epoxy

Two Component, Radiopaque Epoxy System for High Performance Bonding, Sealing, Coating and Encapsulation featuring Outstanding Performance Properties and Easy Handling

EP21HV Product Description

EP21HV Two Part Epoxy

Two Component Epoxy Adhesive For High Performance Bonding, Sealing and Encapsulation

EP21ND Product Information

EP21ND Two Part Epoxy

Two Component, Room Temperature Curing Epoxy for High Performance Bonding, Sealing and Coating with Outstanding Physical Properties, Easy Handling and Non-Drip Feature. Meets Title 21, U.S. Code of Federal Regulations, FDA Chapter 1, Section 175.105 for Food Applications.

EP21ND-LO Product Information

EP21ND-LO Two Part Non-Drip Epoxy

Two Component, Room Temperature Curing Epoxy System for High Performance Bonding, Sealing and Coating with Outstanding Physical Properties, Easy Handling and Non-Drip Application Feature. Meets NASA Low Outgassing Specifications.

EP21Q Product Description

EP21Q Two Part Epoxy

Two Component Quartz Filled Epoxy System For High Performance Bonding, Coating and Sealing with Enhanced Corrosion And Abrasion Resistance

EP21TCHT-1 Product Information

EP21TCHT-1 Two Part Epoxy Adhesive

Two Component, Room Temperature Curing, Thermally Conductive, Electrically Insulating, and Heat Resistant Epoxy Compound for High Performance Bonding and Sealing. Serviceable from 4K to 400°F. Meets NASA Low Outgassing.

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