Two Component Epoxy Resin System for Bonding, Coating and Sealing, Formulated for Outstanding Abrasion Resistance; Features High Shore D Hardness and Convenient One to One Mix Ratio.
Two Component, Low Viscosity Epoxy System for Bonding, Sealing, Coating and Encapsulation with Excellent Physical and Electrical Insulation Properties. Featuring Superb Optical Clarity and Light Transmission.
Two Component, Room Temperature Curable, High Temperature Resistant Epoxy System, Sealant, Coating and Casting System Resists Multiple Cycles of Medical Sterilization Including Radiation, Chemicals and Steam.
Two Component, High Performance Epoxy for Potting, Sealing, Encapsulating and Casting Featuring Superior Electrical Insulation Properties and Resistance to Thermal Shock and Cycling.
Two Component, Low Viscosity Heat Curing Epoxy Resin System High PerformanceThermal Conductive & Electrical Insulation For Potting & Encapsulation Applications
