One Component, Low Viscosity UV Curable System for High Performance Bonding, Sealing & Coating, Featuring Excellent Physical Properties and Dimensional Stability.
One Component, Nanosilica Filled UV Curable Epoxy System with Superb Optical Clarity, Abrasion Resistance and Dimensional Stability for Bonding, Sealing, Coating and Encapsulation. Exceptionally Low Shrinkage.
One Component, UV and Heat Curable Epoxy System for High Performance Bonding, Coating and Sealing. Dual Cure System Allows for Curing in “Shadowed Out” Areas at Temperatures as Low as 80°C.
One Component, Paste Consistency UV Curable Polymer System for High Performance Bonding, Sealing and Encapsulation, Featuring Excellent Physical Strength Properties and Low Shrinkage Upon Cure.
One Component, UV and Heat Curable Polymer System for High Performance Bonding, Sealing, Coating and Encapsulation. Dual Cure System Allows for Curing in “Shadowed Out” Areas.
One Component, Low Viscosity UV Curable Polymer System for High Performance Bonding, Sealing, Coating and Encapsulation, Featuring Excellent Physical Strength Properties and Low Shrinkage Upon Cure.
One Component, Nanosilica Filled UV Curable Epoxy System with Superb Optical Clarity, Abrasion Resistance and Dimensional Stability for Bonding, Sealing, Coating and Encapsulation. Exceptionally Low Shrinkage.
One Component, UV and Heat Curable Epoxy System for High Performance Bonding, Coating and Sealing. Dual Cure System Allows for Curing in “Shadowed Out” Areas at Temperatures as Low as 80°C.
One Component, UV and Heat Curable Epoxy System for High Performance Bonding, Coating and Sealing. Dual Cure System Allows for Curing in “Shadowed Out” Areas at Temperatures as Low as 80°C.
