Two Component Epoxy Resin System for Bonding, Coating and Sealing, Formulated for Outstanding Abrasion Resistance; Features High Shore D Hardness and Convenient One to One Mix Ratio.
One Component, High Viscosity LED Curable System for High Performance Bonding, Sealing, Coating and Encapsulation, Cures Completely at 405 nm Wavelength up to 1/8 Inch Thick; Cures Tack-Free Without Any Oxygen Inhibition; Excellent Physical Properties.
One Component, Room Temperature Curing, Silicone Elastomer System for High Performance Bonding and Sealing; Featuring Paste Consistency, Non-Corrosive Cure and Serviceability Up to 300°C; Unsurpassed Stability at Elevated Temperatures
One Component, Room Temperature Curing Silicone Elastomer Adhesive for High Performance Bonding and Sealing. Fast Curing and Non-Corrosive.Meets MIL-A-46146 Type 2.
One Component, Room Temperature Curing, Silicone Elastomer Adhesive for High Performance Bonding and Sealing; Featuring Flame Retardancy and Very Fast, Non-Corrosive Cure.
Two Component, Addition Cured Silicone for High Performance Bonding and Sealing, Featuring High Temperature Resistance, Excellent Flexibility and Paste Consistency; Self Priming System.
Two Component, Room Temperature Curable, High Temperature Resistant Epoxy System, Sealant, Coating and Casting System Resists Multiple Cycles of Medical Sterilization Including Radiation, Chemicals and Steam.
