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The following is a news release from Master Bond Inc. You have received it because you are listed as an editor for your publication.

Attached to this email is a low resolution version of the photograph that is included in the press kit for this product.

High resolution versions of this image and files with the body text of this release are available at http://www.masterbond.com/mbnr.html?nr=ep29lpsp.

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FOR IMMEDIATE RELEASE

New Epoxy Adhesive Serviceable At Cryogenic Temperatures

HACKENSACK, NJ - May 1, 2008 -- Master Bond Inc., Hackensack, N.J. has introduced a new two component epoxy adhesive/sealant for cryogenic applications. Called EP29LPSP, this compound is able to withstand temperatures as low as 4K. Additionally, it is able to resist cryogenic shocks (i.e. room temperature down to liquid helium temperatures in a 5-10 minute time period).

Master Bond EP29LPSP has a mix ratio of 100 to 65 by weight. It cures at room temperatures, but best results are obtained if heat cured at 130-165°F for 6-8 hours. EP29LPSP features superior physical strength properties and excellent chemical resistance. It bonds well to a variety of substrates including metals, glass, ceramics and many different plastics. When curing, EP29LPSP has a low exotherm.

EP29LPSP has a low viscosity and is easy to apply. Its mixed viscosity is 400 cps. It has a tensile strength of 6,500 psi and a tensile modulus of >375,000 psi. When cured, EP29LPSP is a superior electrical insulator. Its volume resistivity is >10¹⁵ ohm-cm and its dielectric constant is 3.6. It has a Shore D hardness of 80.

Master Bond EP29LPSP is optically clear. It is available for use in pint, quart, gallon and 5 gallon kits. It is also available in syringe applicators.

CONTACT:
James Brenner, Marketing Manager
Email: jbrenner@masterbond.com
Tel: 201-343-8983
Fax: 201-343-2132

MASTER BOND INC.
154 Hobart Street
Hackensack, NJ 07601-3922
Web: www.masterbond.com

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