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The following is a news release from Master Bond Inc. You have received it because you are listed as an editor for your publication.
Attached to this email is a low resolution version of the photograph that is included in the press kit for this product.
High resolution versions of this image and files with the body text of this release are available at http://www.masterbond.com/mbnr.html?nr=ep21an.
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FOR IMMEDIATE RELEASE
New Epoxy System Has Exceptionally High Thermal Conductivity
HACKENSACK, NJ - February 10, 2009 -- Master Bond Inc., Hackensack, N.J. has developed a new two part adhesive system called EP21AN with a thermal conductivity in excess of 22 (BTU•in/ft²•hr•°F). It is an outstanding electrical insulator with a dielectric strength of >400 volts/mil and a volume resistivity greater than 1013 ohm-cm. This easy to use adhesive has been formulated with a non-critical 1/1 mix ratio by weight or volume. It cures readily at ambient temperatures or more quickly at elevated temperatures.
Master Bond EP21AN features excellent adhesion to a wide range of substrates including metals, ceramics, glass and many plastics. Bonds exhibit outstanding dimensional stability and shrinkage upon cure is exceptionally low. Master Bond EP21AN is available in 1/2 pint, pint, quart, gallon and 5 gallon kits.
CONTACT:
James Brenner, Marketing Manager
Email: jbrenner@masterbond.com
Tel: 201-343-8983
Fax: 201-343-2132
MASTER BOND INC.
154 Hobart Street
Hackensack, NJ 07601-3922
Web: www.masterbond.com
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