Expanded Product List
Master Bond Product Search
69 products match
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EP30DP-NV Two part, room temperature curing, lower viscosity system used primarily for potting and encapsulation applications. Excellent thermal cycling properties along with shock and vibration resistance. Low exotherm and long working life. Superb abrasion resistance and electrical insulation characteristics. Repairable. Serviceable from 4K to +250°F. |
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EP30DPBFMed Epoxy-urethane blend. Superior toughness and abrasion resistance. Biocompatible. Cryogenically serviceable. Low viscosity. Low moisture absorption and hydrolytic stability. USP Class VI approved. Serviceable from 4k to +250°F. Outstanding electrical insulation properties. Withstands thermal cycling. High impact strength. |
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EP30DPSP Epoxy-urethane blend. Superior toughness and abrasion resistance. Biocompatible. Cryogenically serviceable. Low viscosity. Low moisture absorption and hydrolytic stability. USP Class VI approved. Serviceable from 4k to +250°F. Outstanding electrical insulation properties. Withstands thermal cycling. High impact strength. |
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EP30FL Low viscosity, optically clear epoxy. Ideal for thermal cycling and bonding sensitive components. Room temperature or low elevated temperature cure. Good flexibility. Superb impact resistance. Shore D hardness 25-40. Serviceable from 4k to +250°F. |
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EP30FLAO Flexibilized, thermally conductive, electrically insulative potting compound. Excellent flowability. Low thermal expansion coefficient. Superior dimensional stability. Serviceable from 4k to +250°F. Resists water, oils, many solvents. Good physical strength properties. |
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EP30FLSP Low viscosity flexibilized two component epoxy resin system. Serviceable from 4k to +250°F. Well suited for potting and encapsulation. Moderately low exotherm. Good peel and shear strength. Adheres well to similar and dissimilar substrates. Resists mechanical shock, vibration and thermal cycling. |
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EP30LTE-LO Black Two component epoxy system. Low thermal expansion coefficient and dimensional stability. Bonding, sealing, casting compound. Passes NASA low outgassing specifications. Room temperature curing. Low shrinkage. Serviceable from 4k to +250°F. Successfully tested for 1,000 hours 85°C/85% RH. |
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EP30LTE-LO Two component epoxy system. Extra low thermal expansion coefficient and unmatched dimensional stability. Bonding, sealing, casting compound. Passes NASA low outgassing specifications. Room temperature curing. Low shrinkage. Serviceable from 4k to +250°F. Successfully tested for 1,000 hours 85°C/85% RH. |
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EP37-3FLF Highly flexible, low viscosity, optically clear adhesive. Resistant to severe thermal cycling and thermal shock. Bonds well to dissimilar substrates. Low exotherm system. Long working life. Superior electrical insulation properties. Service temperature range from 4K to +250°F. One to one mix ratio by weight or volume. |
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EP37-3FLFAN Highly flexible, thermally conductive/electrically insulative epoxy system. Low viscosity. Cures readily at room temperature. Long working life. One to one mix ratio by weight or volume. Serviceable from 4K to +250°F. Good physical strength and chemical resistance. |