Expanded Product List
Master Bond Product Search
184 products match
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Supreme 3CCM-85 One part epoxy system designed for glob tops and small encapsulation. Curing temperature 175-185°F for 2 to 3 hours. Toughened epoxy can withstand thermal cycling. Suitable for bonding and potting. Thermally conductive and electrically insulative. Service temperature range from -100°F to +350°F. |
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Supreme 3DM-85 One part epoxy for bonding, sealing, and dam-and-fill applications, and chip on board encapsulations. Cures at 185°F. Reliable electrical insulator, Used as a barrier to block flow. Thermally conductive, electrically isolating, paste consistency. |
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Supreme 3HTND-1SM One part, oven curing system (cures at 125-150°C) with rapid curing. Good physical properties. Paste consistency. Recommended for surface mounting. Void filling. Low ioinic impurities. Superior "green" strength. No stringing. Withstands thermal stress. Consistent dot profile. Can be automatically dispensed for high volume applications. Serviceable from -100°F to +350°F. |
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Supreme 3HTND-2CCM Toughened epoxy system for bonding, sealing, coating, encapsulation, glob topping. Requires no mixing. Rapid heat curing Passes NASA low outgassing testing. Transfers heat efficiently. Ideal rheology and flow for multiple applications. Stellar electrical insulation properties. Serviceable from -100°F to +400°F. |
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Supreme 3HTND-2DA One component, fast curing die attach adhesive. Excellent die shear strength. Serviceable from -100°F to +400°F. Low ionics. Superior thermal conductivity and electrical insulation properties. Dispenses smoothly without tailing or bleed out. Cures in 5-10 minutes at 150°C. NASA low outgassing approved. Available in syringes. Well suited for automatic dispensing. Performed well in 85°C/85% RH testing. |
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Supreme 3HTND-2DM Toughened epoxy paste system for damming applications. Requires no mixing. Rapid heat curing. Passes NASA low outgassing testing. Transfers heat efficiently. Stellar electrical insulation properties. Serviceable from -100°F to +400°F. |
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Supreme 3HTND-2DM-1 Toughened epoxy system for bonding, sealing and specialty dam-and-fill encapsulation. Requires no mixing. Rapid heat curing. Passes NASA low outgassing testing. Transfers heat efficiently. Stellar electrical insulation properties. Serviceable from -100°F to +400°F. |
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Supreme 3HTND-2GT Superior one part glob top. Outstanding dimensional stability and temperature resistance. Fast cures at 125-150°C. Ideal flow for glob topping. Serviceable from -100°F to +400°F. Excellent electrical insulation properties. Low shrinkage. Resists thermal cycling. |
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Supreme 3HTS-80 One component, silver conductive epoxy adhesive featuring high shear and high peel strengths. Cures at 175°F to 185°F. Bonds well to many substrates. Single part no mix system. Serviceable from -100°F to +350°F. Requires refrigeration, no freezing necessary |
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Supreme 45HTAO Toughened, thermally conductive epoxy compound. Superb electrical insulator. Resists -80°F to +500°F. High strength properties. Two part system. Oven curing. Long-term durability. |