Expanded Product List
Master Bond Product Search
184 products match
 |
Supreme 121AOND Thermally conductive, electrically insulative. Outstanding dimensional stability. Passes NASA low outgassing tests. Very long open time. Paste consistency. Ideally suited for potting applications. Serviceable from -80°F to +550°F. Black in color. Requires oven curing. |
 |
Supreme 12AOHT-LO One component, heat cure system for bonding, sealing. High strength product. Service operating temperature range from 4K to +500°F (260°C). Resists aggressive thermal cycling and shock. Substantial thermal conductivity of 9-10 BTU in/ft2 hr °F. Smooth thixotropic paste. NASA low outgassing approved. Meets MIL-STD-883J Section 3.5.2 for thermal stability. Withstands 1,000 hours 85°C/85% RH. |
 |
Supreme 18TC single component epoxy adhesive features unmatched heat transfer properties. Capable of being applied in bond lines as thin as 10-15 microns. Low coefficient of thermal expansion. Meets NASA low outgassing specifications. Low shrinkage upon curing Operating temperature is 4k to +400°F. |
 |
Supreme 30AOHT Toughened, two component, thermally conductive/electrically insulative epoxy system. Bonding, sealing, casting compound. Resists chemical exposure and thermal cycling. 100% reactive. Low exotherm. High T-peel strength. Ambient temperature curing. Service temperature range -60°F to +250°F. |
 |
Supreme 34AO Room temperature curing epoxy with high thermal stability. Serviceable from -60°F to +450°F. Thermal conductive/electrically insulative. Paste viscosity. Gap filling. Superior durability. Low CTE. High bond strength. Resists repeated thermal cycling. |
 |
Supreme 3AN One part epoxy adhesive offers exceptional thermal conductivity. Good electrical insulating properties. Cures in 5-10 minutes at 300°F or 20-30 minutes at 250°F. Bonds withstand thermal cycling, vibration, stress fatigue cracking. Serviceable from -100°F to +250°F. |
 |
Supreme 3ANHT Toughened, single component high temperature resistant thermal conductive adhesive. Good electrical insulative properties. No mixing required. Adhesive bonds well to similar and dissimilar substrates. Thick paste viscosity. Shore D hardnes >75. Serviceable from -100°F to +350°F. |
 |
Supreme 3ANLV-1 Toughened, single component high temperature resistant thermal conductive adhesive. Good electrical insulative properties. No mixing required. Adhesive bonds well to similar and dissimilar substrates. Flowable viscosity. Shore D hardness 80-90. Serviceable from -100°F to +300°F. |
 |
Supreme 3AO Low temperature curing thermal conductive epoxy adhesive. Outstanding toughness and durability. Dimensional stability. Easy application. Gray color. Serviceable from -100°F to +300°F. |
 |
Supreme 3AOHT One component, fast heat curing system. Can withstand rigorous thermal cycling. Thermally conductive, electrically insulative. Paste viscosity. Serviceable up to 350°F. |