A new flexible, tough epoxy potting and encapsulation compound called EP30FL has been introduced by Master Bond Inc., Hackensack, NJ. Master Bond EP30FL has extraordinarily low viscosity and is easy to apply. It can be used in both thick and thin cross sections. This compound is 100% reactive and does not contain any volatiles.
Master Bond EP21TDCSFL is a new two component, room temperature curing, silver filled, epoxy adhesive developed by Master Bond Inc., Hackensack, N.J. It exhibits high flexibility and has an elongation of >60%. EP21TDCSFL is easy to use and has a 1 to 1 mix ratio by weight or volume. It cures at room temperatures or more rapidly at elevated temperatures.
MasterSil 151 is a new two component, low viscosity silicone compound for high performance casting, potting and encapsulation introduced by Master Bond Inc., Hackensack, N.J. This formulation is designed to cure at room temperature or more rapidly at elevated temperatures. MasterSil 151 has superior electrical insulation properties, high tensile strength and superb optical clarity.
Achievement of high performance cures at low temperatures has long been a problem for epoxy resin compositions. Master Bond Inc. has successfully overcome this problem with a newly developed epoxy resin
system called Master Bond EP27. In 6 mil thick films, EP27 will set in as little as 2 hours at only 40°F and will cure in 48-72 hours.
Master Bond has successfully developed a new, highly flexible two component epoxy resin compound called EP40 which features outstanding shear and peel strength and is especially designed for bonding, sealing and casting engineering plastics and metals.
Master Bond Inc., Hackensack, N.J. is proud to announce the development of a new two component, room temperature curing epoxy adhesive called EP21HT. This system is easy to use and has a convenient, forgiving 1 to 1 mix ratio by weight or volume. EP21HT is 100% reactive and contains no solvents or volatiles.