Master Bond MasterSil 323S-LO is an addition cured silicone that is not only electrically conductive,
but also thermally conductive. This ASTM E-595 low outgassing rated product is designed for bonding applications where low stress is critical and is appropriate for use in vacuum environments. It can be utilized in the aerospace, electronic, opto-electronic, and specialty OEM industries.
Master Bond EP114 is a two component, low viscosity, NASA low outgassing rated, heat cured epoxy that can be effectively utilized
for underfill, coating, impregnating and porosity sealing applications. This optically clear compound features high dimensional
Master Bond UV15RCL is a low viscosity, cationic type UV curing system with a special color changing feature.
The originally red material changes to clear once exposed to UV light, indicating that there is UV light access across the adhesive material.
Master Bond Supreme 11AOHTMed is a two component epoxy featuring thermal conductivity and electrical insulation.
This system fully passes ISO 10993-5 testing for non-cytotoxicity and is recommended for bonding and sealing in medical device applications.
EP42HT-2FG Black is a two part, moderate heat cured epoxy with high temperature resistance that complies
with FDA 21 CFR 175.105 for indirect food contact applications. The epoxy withstands exposure to a wide range of harsh chemicals,
including acids, bases, and solvents. It possesses good flow properties and can be employed for bonding, sealing, potting, and casting.
Master Bond UV23FLDC-80TK is a moderate viscosity, cationic type system that offers both UV light and heat curing mechanisms.
It cures readily within 20-30 seconds when exposed to a UV light source emitting a wavelength of 320-365 nm.
The adhesive can also undergo a secondary heat curing for shadowed areas, typically curing in 60-90 minutes at 80-85°C.