Featuring a silicon carbide filler, Master Bond Supreme 45HTQ-4 is a toughened epoxy for high performance bonding, sealing, coating and casting. This specialty system can be used for a wide variety of special industrial, aerospace, OEM and oil processing applications, especially in downhole situations.
Toughened One Component Epoxy for Chip Coating Applications Meets NASA Low Outgassing Specifications
Formulated for many electronic applications, Master Bond Supreme 3HTND-2CCM is a multifunctional epoxy that is well suited for chip coating, glob top and die attach applications as well as for bonding, sealing and encapsulation. Since it is a one part system, it does not require mixing and has an “unlimited” working life at room temperature.
Master Bond UV15X-6NM-2 is a one component UV curing urethane acrylate system formulated for a variety of bonding, sealing, coating and encapsulation applications. This moderate viscosity product features flexibility, toughness and abrasion resistance. It is widely used for fiber-optic, optical, electronic, semiconductor, microelectronic and laser applications.
Master Bond Supreme 18TC is a single component epoxy adhesive that contains a blend of special thermally conductive fillers. This smooth paste system can be applied in bond lines as thin as 10-15 microns. It offers an exceptionally low thermal resistance of 5-7 x 10-6 K•m2/W and a thermal conductivity of 22-25 BTU•in/ft2•hr•°F [3.17-3.61 W/(m·K)].
Developed for high tech bonding and sealing applications, Master Bond Supreme 11HTLP is a two part epoxy that is often selected for the aerospace, electronics and specialty OEM industries. It combines user friendly processing with a high physical strength profile.
Master Bond MasterSil 972TC-LO passes the rigorous requirements for low outgassing per ASTM E595 specifications. It is particularly well suited for use in vacuum environments as well as applications in the aerospace, electronic, opto-electronic and specialty OEM industries. This two part silicone system offers convenient handling for bonding, sealing, coating and potting.