Master Bond EP40Med, a two part epoxy system, combines toughness and a low tensile modulus while still providing a relatively high lap shear strength.
It meets the requirements of ISO 10993-5 testing and is therefore considered to be non-cytotoxic. This compound can be used for bonding, sealing, coating and encapsulating.
Master Bond EP35SP is a two part epoxy system for bonding and sealing applications, providing resistance to many chemicals such as oils, acids, bases, water, fuels, and especially petrochemicals.
Master Bond EP17HTS-DA is a new one component, no mix, die attach epoxy that is electrically conductive and withstands high temperatures.
It is a silver filled system. Typically, glass transition temperature (Tg) declines with the addition of a filler like silver.
Master Bond EP21TPHT is a new two component epoxy polysulfide system designed for bonding applications that require toughened and thermally stable
bonds resistant to chemicals. It resists temperatures up to 350°F, much higher than typical epoxy polysulfide systems.
Master Bond EP30DPBFMed is a two part, flexibilized epoxy-urethane hybrid system that can be used for bonding, sealing, coating, and encapsulation.
It is formulated for disposable and reusable medical devices, meeting USP Class VI requirements while also complying with RoHS3 in accordance
Master Bond EP29LPTCHT is a two component, low viscosity epoxy compound that can be effectively utilized for underfill and encapsulation applications.
It does not need excessive heat for curing and has a long working life at room temperature. This system is electrically insulative and thermally conductive