Master Bond Products Covered in this Infographic
EP113 Two component nanosilica filled epoxy for potting, coating and sealing. Optically clear. Low shrinkage. Superior electrical insulation properties. Toughened system. Successfully tested for 1,000 hours 85°C/85% RH. Serviceable from -100°F to +450°F. |
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UV22 UV curable, nanosilica filled system with excellent abrasion resistance. Easy to apply and fast room temperature curing upon exposure to UV light. Meets NASA low outgassing requirements. Excellent optical clarity. Superior dimensional stability. Withstands 1,000 hours 85°C/85% RH. Tg is 135°C after post curing for 30 minutes at 125-150°C. Serviceable from -80°F to +350°F. |
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UV22DC80-1 Dual cure system with UV and heat curing mechanisms. Cures at 80°C in shadowed out areas. Nano filled, high dimensional stability and abrasion resistance. Bonds well to metals, glass, ceramics and most plastics. Serviceable from -60°F to +350°F. |
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EP30NS Moderate viscosity Nanosilica epoxy resin system. High strength rigid bonds. Lower linear shrinkage after cure. Serviceable from -60°F to +300°F. Cures readily at room temperature. Passes ASTM E595 for NASA low outgassing. |